We all know CERN as that cool place where physicists play with massive, superconducting rings to smash atoms and subatomic particles to uncover secrets of matter in the Universe. To achieve this aim, they need to do a ton of research in other areas, such as development of special particle detectors.

While such developments are essential to the core research needs of the Centre, they also lead to spinoff applications for the benefit of society at large. One such outcome has been the Medipix Collaborations – a family of read-out chips for particle imaging and detection that can count single photons, allowing X-rays and gamma rays to be converted to electrical signals. It may not be possible for us hackers to get our hands on these esoteric sensors, but these devices are pretty interesting and deserve a closer look. Medipix sensors work like a camera, detecting and counting each individual particle hitting the pixels when its electronic shutter is open. This enables high-resolution, high-contrast, noise hit free images – making it unique for imaging applications.

Some months back, CERN announced the first 3D color X-ray of a human made possible using the Medipix devices. The result is a high-resolution, 3D, color image of not just living structures like bones, muscular tissues and vessels, but metal objects too like the wrist watch, seen in the accompanying photograph. The Medipix sensors have been in development since the 1990’s and are presently in their 4th “generation”. Each chip consists of a top semiconducting sensor array, made from gallium arsenide or cadmium telluride. The charge collected by each pixel is transported to the CMOS ASIC electronics via “bump bonds”. The integration is vertical, with each sensing pixel connected via the bump bond to an analog section followed by a digital processing layer. Earlier versions were limited, by technology, in their tiling ability for creating larger matrices of multiple sensors. They could be abutted on three sides only, with the fourth being used for on-chip peripheral logic and wire-bond pads that permit electronic read-out. The latest Medipix4 Collaboration, still under some development, eliminates this short coming. Through-silicon-via (TSV) technology provides the possibility of reading the chips through copper-filled holes that bring the signals from the front side of the chip to its rear. All communication with the pixel matrix flows through the rear of the chip – the peripheral logic and control elements are integrated inside the pixel matrix.

The Analog front end consists of a pre-amplifier followed by a window discriminator which has upper and lower threshold levels. The discriminator has four bits for threshold adjustment as well as polarity sensing. This allows the capture window to be precisely set. The rest of the digital electronics – multiplexers, shift registers, shutter and logic control – helps extract the data.

Further development of the Medipix …read more

Source:: Hackaday